JPS6214100B2 - - Google Patents

Info

Publication number
JPS6214100B2
JPS6214100B2 JP56190295A JP19029581A JPS6214100B2 JP S6214100 B2 JPS6214100 B2 JP S6214100B2 JP 56190295 A JP56190295 A JP 56190295A JP 19029581 A JP19029581 A JP 19029581A JP S6214100 B2 JPS6214100 B2 JP S6214100B2
Authority
JP
Japan
Prior art keywords
polyimide
epoxy resin
silicone resin
semiconductor element
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56190295A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5891663A (ja
Inventor
Mototaka Kamoshita
Yasushi Okuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56190295A priority Critical patent/JPS5891663A/ja
Publication of JPS5891663A publication Critical patent/JPS5891663A/ja
Publication of JPS6214100B2 publication Critical patent/JPS6214100B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP56190295A 1981-11-27 1981-11-27 半導体装置およびその製造方法 Granted JPS5891663A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56190295A JPS5891663A (ja) 1981-11-27 1981-11-27 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56190295A JPS5891663A (ja) 1981-11-27 1981-11-27 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS5891663A JPS5891663A (ja) 1983-05-31
JPS6214100B2 true JPS6214100B2 (en]) 1987-03-31

Family

ID=16255785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56190295A Granted JPS5891663A (ja) 1981-11-27 1981-11-27 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS5891663A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987840A (ja) * 1982-11-10 1984-05-21 Toray Silicone Co Ltd 半導体装置
JPS59121956A (ja) * 1982-12-28 1984-07-14 Tomoegawa Paper Co Ltd 耐熱性接着シ−ト
JPH0611039B2 (ja) * 1983-11-16 1994-02-09 東芝ケミカル株式会社 半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029851B2 (en]) * 1971-10-25 1975-09-26
JPS5521175A (en) * 1978-08-02 1980-02-15 Nec Home Electronics Ltd Semiconductor device
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS55128845A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Semiconductor device
JPS55140249A (en) * 1979-04-18 1980-11-01 Fujitsu Ltd Semiconductor device
JPS5748251A (en) * 1980-09-04 1982-03-19 Mitsubishi Electric Corp Semiconductor device
JPS5848950A (ja) * 1981-09-18 1983-03-23 Nec Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS5891663A (ja) 1983-05-31

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